Ceramic scribe substrate, ceramic substrate, method for manufacturing ceramic scribe substrate, method for manufacturing ceramic substrate, method for manufacturing ceramic circuit board, and method for manufacturing semiconductor element
AssigneeNiterra Materials Co., Ltd.
InventorsYukihisa Matsumoto, Naoto Hoshino
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Abstract
A ceramic scribe substrate according to the present embodiment includes a continuous groove having multiple grooves connected to each other formed by fiber laser irradiation on a surface portion of a scribe line shaping a ceramic substrate. The continuous groove has a depth of more than 50 μm within a range of 0.15 times or more and 0.55 times or less a thickness of the ceramic substrate.
Claims16
A ceramic scribe substrate comprising a continuous groove having multiple grooves connected to each other formed by fiber laser irradiation on a surface portion of a scribe line shaping a ceramic substrate, wherein
- the continuous groove has a depth of more than 50 μm within a range of 0.15 times or more and 0.55 times or less a thickness of the ceramic substrate.
A ceramic substrate comprising a continuous groove having multiple grooves connected to each other formed by fiber laser irradiation on a surface portion of at least one of four side scribe lines, wherein
- the continuous groove has a depth of more than 50 μm within a range of 0.15 times or more and 0.55 times or less a thickness of the ceramic substrate.
Dependencies are inferred from the claim text.