MEMS structure
AssigneeFortemedia, Inc.
InventorsJien-Ming Chen, Wen-Shan Lin, Chun-Kai Mao, Feng-Chia Hsu, Chih-Yuan Chen, Nai-Hao Kuo
Life of this patent
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Abstract
A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate and having acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate and extending across the opening portion of the substrate. The diaphragm includes ventilation holes, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a coverage structure disposed on the sidewall of at least one ventilation hole.
Claims18
A micro-electro-mechanical system structure, comprising:
- a substrate having an opening portion;
- a backplate disposed on one side of the substrate and having acoustic holes;
- a diaphragm disposed between the substrate and the backplate, extending across the opening portion of the substrate, and comprising a plurality of ventilation holes, wherein an air gap is formed between the diaphragm and the backplate;
- and
- a plurality of coverage structures disposed on sidewalls of the plurality of ventilation holes, wherein the plurality of coverage structures is provided in a layer different from the diaphragm, wherein the plurality of coverage structures partially cover respective sidewalls of the plurality of ventilation holes such that portions of respective sidewalls of the diaphragm remain exposed, and in a vertical direction pointing from the substrate to the backplate, a top-most surface of the coverage structure is lower than a top surface of the diaphragm.
Dependencies are inferred from the claim text.