Method of processing substrate
AssigneeSemes Co., Ltd.
InventorEuihwan Kim
Life of this patent
Estimating the term…
Abstract
In a method of processing a substrate, a test film having a first area and a second area adjacent to the first area is provided. A first jet value is obtained from a first test pattern formed by jetting a chemical solution through a plurality of nozzles onto the first area of the test film. The chemical solution is jetted onto a first substrate based on the first jet value. A second jet value is obtained from a second test pattern formed by jetting the chemical solution through the plurality of nozzles onto the second area of the test film. The chemical solution is jetted onto a second substrate based on the second jet value.
Claims20
A method of processing a substrate, comprising:
- providing a test film including a first area and a second area adjacent to the first area;
- obtaining a first jet value from a first test pattern formed by jetting a chemical solution through a plurality of nozzles onto the first area of the test film;
- jetting the chemical solution onto a first substrate based on the first jet value;
- obtaining a second jet value from a second test pattern formed by jetting the chemical solution through the plurality of nozzles onto the second area of the test film;
- and
- jetting the chemical solution onto a second substrate based on the second jet value.
A method of processing a substrate, comprising:
- obtaining a first jet value from a first test pattern formed by jetting a chemical solution through a plurality of nozzles onto the first area of the test film;
- jetting the chemical solution onto a first substrate through calibrating a jet direction of the plurality of nozzles based on the first jet value;
- obtaining a second jet value from a second test pattern formed by jetting the chemical solution through the plurality of nozzles onto a second area adjacent to the first area of the test film;
- and
- jetting the chemical solution onto a second substrate through calibrating the jet direction of the plurality of nozzles based on the second jet value.
A method of processing a substrate, comprising:
- providing a first test film including first to third reference areas;
- obtaining first to third reference jet values from first to third reference test patterns formed by jetting a chemical solution through a plurality of nozzles onto the first to third reference areas of the first test film, respectively;
- calibrating the second and third reference jet values based on the first reference jet value to obtain first and second calibration values, respectively;
- providing a second test film including first to third areas;
- obtaining a first jet value from a first test pattern formed by jetting the chemical solution through the plurality of nozzles onto the first area of the second test film;
- jetting the chemical solution onto a first substrate through calibrating a jet direction of each of the plurality of nozzles using the first jet value calibrated based on the first reference jet value;
- obtaining a second jet value from a second test pattern formed by jetting the chemical solution through the plurality of nozzles onto the second area of the second test film;
- jetting the chemical solution onto a second substrate through calibrating the jet direction of each of the plurality of nozzles using the second jet value calibrated based on the first calibration value;
- obtaining a third jet value from a third test pattern formed by jetting the chemical solution through the plurality of nozzles onto the third area of the second test film;
- and
- jetting the chemical solution onto a third substrate through calibrating the jet direction of each of the plurality of nozzles using the third jet value calibrated based on the second calibration value.
Dependencies are inferred from the claim text.