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US 12,679,088 B2Granted
Head module
AssigneeBrother Kogyo Kabushiki Kaisha
InventorItsuki Morimoto
Life of this patent
Estimating the term…
Abstract
A head module includes: a head chip having a nozzle plate and an IC; a cooler which is in thermal contact with the IC and which is configured to cool the IC; and a supplying device fluidly connected to the head chip and configured to supply ink to the head chip. In a first direction orthogonal to the nozzle plate, the cooler and the supplying device are positioned on one side with respect to the nozzle plate, the cooler and the supplying device are overlapped as seen from the first direction, and the cooler and the supplying device are thermally isolated from each other.
Claims17
A head module, comprising:
- a head chip having a nozzle plate and an IC;
- a cooler which is in thermal contact with the IC and which is configured to cool the IC;
- and
- a supplying device fluidly connected to the head chip and configured to supply ink to the head chip, the supplying device having a main body part, a first projecting part and a second projecting part,
- wherein in a first direction orthogonal to the nozzle plate, the cooler and the supplying device are positioned on one side with respect to the nozzle plate,
- the cooler and the main body part of the supplying device are overlapped with each other as seen from the first direction,
- the cooler and the first projecting part are not overlapped with each other as seen from the first direction,
- the cooler and the second projecting part are not overlapped with each other as seen from the first direction,
- the cooler is positioned between the first projecting part of the supplying device and the second projecting part of the supplying device in a second direction orthogonal to the first direction, and
- the cooler and the main body part of the supplying device are thermally isolated from each other.
7 more elements
Dependencies are inferred from the claim text.