Phenolic panel and attachment/detachment system and process

A panel attachment system, the panel attachment system comprising:

• a laminate panel, the laminate panel comprising (i) a non-magnetic panel having an outer side and an inner side, (ii) a heatable substrate having an outer side bonded at the inner side of the non-magnetic panel via a first layer of a higher melting point adhesive and (iii) a non-magnetic shield having an outer side bonded at an inner side of the heatable substrate, opposite from the outer side of the heatable substrate, via a second layer of higher melting point adhesive;
• wherein the heatable substrate comprises a ferromagnetic material and an electrically conductive material, and wherein the heatable substrate is heated by energizing the electrically conductive material to create a magnetic field at the ferromagnetic material;
• a layer of a lower melting point adhesive is applied at an inner side of the non-magnetic shield opposite from the outer side of the non-magnetic shield;
• wherein the lower melting point adhesive has a melting point, and wherein the lower melting point adhesive melts when heated to a temperature above the melting point of the lower melting point adhesive;
• wherein, with the laminate panel disposed at a metal part, the heatable substrate is heated to heat the laminate panel to a first temperature that is greater than the melting point of the lower melting point adhesive;
• and
• with the laminate panel heated to the first temperature, the lower melting point adhesive melts, and wherein the lower melting point adhesive cures to bond the laminate panel to the metal part.

A panel detachment system, the panel detachment system comprising:

• a first part, the first part comprising a (i) a non-magnetic panel having an outer side and an inner side, (ii) a heatable substrate having an outer side bonded at the inner side of the non-magnetic panel and (iii) a non-magnetic shield having an outer side bonded at an inner side of the heatable substrate opposite from the outer side of the heatable substrate;
• wherein the heatable substrate comprises a ferromagnetic material, and wherein the ferromagnetic material generates heat at the first part responsive to an electromagnetic field generated at the first part;
• wherein the first part is adhesively attached at a second part via a lower melting point adhesive, and wherein the lower melting point adhesive is between the second part and an inner side of the non-magnetic shield opposite from the outer side of the non-magnetic shield;
• wherein the lower melting point adhesive has a melting point;
• wherein, with the first part adhesively attached at the second part, the electromagnetic field is generated at the first part to heat the first part to a first temperature that is greater than the melting point of the lower melting point adhesive;
• and
• with the first part heated to the first temperature, the lower melting point adhesive melts and releases from the second part to allow the first part to be removed from the second part.