Method for comparing laser processing systems and method for monitoring a laser processing process and associated laser processing system

A method for operating a laser machining system, wherein the laser machining system comprises a laser machining head and a sensor module having at least one photodiode for detecting process radiation, said method comprising:

• detecting radiation emitted from a light source by said photodiode and generating a corresponding intensity signal, wherein the radiation is guided from said light source to said photodiode by at least one optical element in said laser machining head and/or by at least one optical element of said sensor module, wherein the radiation emitted from the light source is not reflected from a workpiece before being detected by said photodiode;
• aligning said laser machining head and said light source with one another so that the intensity signal assumes a maximum value;
• comparing the maximum value of the intensity signal with at least one predetermined reference value;
• and
• determining a scaling factor based on the comparison of the maximum value of the intensity signal and the at least one predetermined reference value,
• wherein said light source is a stabilized and/or adjustable and/or controllable light source,
• whereby the laser machining system is inspected independently of laser machining process and the laser machining process carried out by the laser machining system is monitored using the scaling factor.

A method for comparing at least two laser machining systems, wherein each of the laser machining systems comprises a laser machining head and a sensor module having at least one photodiode for detecting process radiation, said method comprising the following steps performed by a first laser machining system:

• detecting radiation emitted from a light source by said photodiode and generating a corresponding intensity signal, wherein the radiation is guided from said light source to said photodiode by at least one optical element in said laser machining head and/or by at least one optical element of said sensor module;
• aligning said laser machining head and said light source with one another so that the intensity signal assumes a maximum value;
• and
• comparing the maximum value of the intensity signal with at least one predetermined reference value,
• wherein said method further comprises the following steps performed by a second laser machining system:
• detecting radiation emitted from the light source by said photodiode and generating a corresponding intensity signal, wherein the radiation is guided from said light source to said photodiode by at least one optical element in said laser machining head and/or by at least one optical element of said sensor module;
• aligning said laser machining head and said light source with one another so that the intensity signal assumes a maximum value;
• and
• comparing the maximum value of the intensity signal with the predetermined reference value,
• the method further comprises determining a scaling factor based on the comparison of the maximum value of the intensity signal and the at least one predetermined reference value for each of the laser machining systems,
• wherein each light source is a stabilized and/or adjustable and/or controllable light source,
• whereby the first and second laser machining systems are inspected independently of laser machining processes and the laser machining processes carried out by the first and second laser machining systems are monitored using the scaling factor of the first and second laser machining systems.