Bonding device and bonding method for friction stir bonding and resistance welding

A bonding device for joining together a first member, an intermediate member, and a second member which are electroconductive, extend along a prescribed major plane, and are layered in this order as a laminated assembly, comprising:

• an anvil configured to support a first surface of the laminated assembly provided by the first member, and including an electroconductive part abutting against the first surface;
• a probe configured to rotate around a central axial line crossing the major plane and move toward and away from a second surface of the laminated assembly provided by the second member at a position corresponding to the anvil, the probe being at least partly electroconductive and having a tip end;
• a drive mechanism configured to rotate the probe around the central axial line and move the probe toward and away from the second member along the central axial line;
• an electric power supply electrically connected to the anvil and the probe to conduct electric current through the laminated assembly via the anvil and the probe;
• and
• a control unit for controlling operation of the drive mechanism and the electric power supply, the control unit configured to:
• control the drive mechanism to push the probe into the laminated assembly from the second surface while rotating the probe around the central axial line;
• monitor a position of the tip end of the probe along the central axial line;
• control the electric power supply to initiate conduction of electric current between the probe and the anvil once the tip end of the probe reaches the intermediate member;
• and then
• control the drive mechanism to pull the probe away from the laminated assembly,
• thereby the first member and the intermediate member are joined to each other by resistance welding and the second member and the intermediate member are joined to each other by friction stir bonding.