Back to results
US 12,678,850 B2Granted
Molding device
AssigneeSumitomo Heavy Industries, Ltd.
InventorsKei Yamauchi, Eiji Kouyama, Hiroyuki Kan, Norieda Ueno
Life of this patent
Estimating the term…
Abstract
A molding device supplies a fluid and performs expansion molding of a metal material using at least a part of members of an existing press device.
Claims9
A molding device configured to perform expansion molding of a metal material by supplying a fluid to the metal material and configured to be installed in an existing press device, the molding device comprising:
- a first die and a second die facing each other;
- and
- a load receiver configured to receive, from a slide of the existing press device, a load to stop a die closing operation during die closing of the first die and the second die, the slide being configured to move the first die toward the second die,
- wherein the load receiver is configured to
- stop the die closing operation at a predetermined position between a die closing start position and a die closing completion position when a first pressure is applied to the load receiver, and
- allow the die closing operation when a second pressure higher than the first pressure is applied to the load receiver.
3 more elements
Dependencies are inferred from the claim text.