Resins for use in toys and methods of making the same
AssigneeMGA Entertainment, Inc.
InventorsXiao Jian Guo, Leung Hoi Yan, Lau Ka Keung
Life of this patent
Estimating the term…
Abstract
Resins for use in toys and methods for making the same are provided. In preferred embodiments, the resins comprise 30% to 55% w/w of Ethoxylated (10) Bisphenol A Diacrylate; 20% to 35% w/w of 1,3-Hexanediol, 2-ethyl-, polymer with 1,6-diisocyanatohexane, 2-hydroxyethyl acrylate- and propylene glycol monoacrylate-blocked; 20% to 30% w/w of Hexanedioic acid, polymer with 1,2-ethanediol and 5-isocyanato-1-(isocyanatometheyl)-1,3,3-trimethylcyclohexane, 2-hydroxyethyl acrylate-blocked; 1.9%±0.5% w/w of 1-Hydroxycyclohexyl phenyl ketone; 0.43%±0.05% w/w of Ethyl trimethylbenzoyl phenylphosphinate; 0.07±0.05% w/w of Diphenyl (2, 4, 6-trimethyl benzoyl) phosphine oxide; and less than 0.19% w/w of 2-hydroxyethyl acrylate.
Claims19
A resin for use in toy kits comprising:
- 30% to 55% w/w of Ethoxylated (10) Bisphenol A Diacrylate;
- 20% to 35% w/w of 1,3-Hexanediol, 2-ethyl-, polymer with 1,6-diisocyanatohexane, 2-hydroxyethyl acrylate- and propylene glycol monoacrylate-blocked;
- 20% to 30% w/w of Hexanedioic acid, polymer with 1,2-ethanediol and 5-isocyanato-1-(isocyanatometheyl)-1,3,3-trimethylcyclohexane, 2-hydroxyethyl acrylate-blocked;
- 1.9%±0.5% w/w of 1-Hydroxycyclohexyl phenyl ketone;
- 0.43%±0.05% w/w of Ethyl trimethylbenzoyl phenylphosphinate;
- 0.07±0.05% w/w of Diphenyl (2, 4, 6-trimethyl benzoyl) phosphine oxide;
- and
- less than 0.19% w/w of 2-hydroxyethyl acrylate.
A resin for use in toy kits comprising:
- 30% to 35% w/w of Ethoxylated (10) Bisphenol A Diacrylate;
- 25% to 35% w/w of 1,3-Hexanediol, 2-ethyl-, polymer with 1,6-diisocyanatohexane, 2-hydroxyethyl acrylate- and propylene glycol monoacrylate-blocked;
- 25% to 30% w/w of Hexanedioic acid, polymer with 1,2-ethanediol and 5-isocyanato-1-(isocyanatometheyl)-1,3,3-trimethylcyclohexane, 2-hydroxyethyl acrylate-blocked;
- 1.9%±0.5% w/w of 1-Hydroxycyclohexyl phenyl ketone;
- 0.43%±0.05% w/w of Ethyl trimethylbenzoyl phenylphosphinate;
- 0.07±0.05% w/w of Diphenyl (2, 4, 6-trimethyl benzoyl) phosphine oxide;
- 1%-9% w/w silicon dioxide;
- and
- less than 0.19% w/w of 2-hydroxyethyl acrylate.
A resin for use in toy kits consisting essentially of:
- 40% to 50% w/w of Ethoxylated (10) Bisphenol A Diacrylate;
- 20% to 25% w/w of 1,3-Hexanediol, 2-ethyl-, polymer with 1,6-diisocyanatohexane, 2-hydroxyethyl acrylate- and propylene glycol monoacrylate-blocked;
- 20% to 25% w/w of Hexanedioic acid, polymer with 1,2-ethanediol and 5-isocyanato-1-(isocyanatometheyl)-1,3,3-trimethylcyclohexane, 2-hydroxyethyl acrylate-blocked;
- 1.9%±0.5% w/w of 1-Hydroxycyclohexyl phenyl ketone;
- 0.43%±0.05% w/w of Ethyl trimethylbenzoyl phenylphosphinate;
- 0.07±0.05% w/w of Diphenyl (2, 4, 6-trimethyl benzoyl) phosphine oxide;
- 1%-9% w/w silicon dioxide;
- and
- less than 0.19% w/w of 2-hydroxyethyl acrylate.
Dependencies are inferred from the claim text.