Flexible electrode for brain and method for manufacturing same

A flexible electrode for a brain, comprising:

• a cortical attachment portion capable of being implanted into the brain;
• and
• one or more deep implantation portions;
• wherein the cortical attachment portion has a sheet-like structure capable of covering and being flattened to fit against at least a portion of a cerebral cortex after an implantation;
• wherein the one or more deep implantation portions being configured to be implanted into a deep region of the brain and bent relative to the cortical attachment portion after the implantation;
• wherein the flexible electrode comprises:
• a first insulating layer,
• a second insulating layer, and
• a wire layer located between the first insulating layer and the second insulating layer;
• and
• wherein at least one of the one or more deep implantation portions and the cortical attachment portion, each comprises one or more electrode sites, each of which is electrically coupled to at least one wire in the wire layer and in contact with the brain after the flexible electrode is implanted into the brain, to acquire, from the brain, at least one first electrical signal and transmit the at least one first acquired electrical signal by the at least one wire, or apply, to the brain, at least one second electrical signal received by the at least one wire;
• wherein the wire layer comprises a conductive sub-layer;
• wherein a material of the conductive sub-layer is any one of gold, platinum, iridium, tungsten, platinum iridium alloy, titanium alloy, graphite, carbon nanotube, PEDOT, or any combination thereof;
• and
• wherein the conductive sub-layer has a thickness of 5 nanometers to 200 micrometers, or, when neither at least one electrode site nor at least one backend site is located in the wire layer, the wire layer further comprises an adhesion sub-layer close to either the at least one electrode site or the at least one backend site, and a material of the adhesion sub-layer is any one of chromium, tantalum, tantalum nitride, titanium, titanium nitride, or any combination thereof.