Semiconductor package
AssigneeLG Innotek Co., Ltd.
InventorsHodol Yoo, Seongun Eom, Yongsoo Lee
Life of this patent
Estimating the term…
Abstract
A semiconductor package substrate including a substrate; a first protective layer disposed on the substrate and including a through hole; and a second protective layer disposed inside the through hole of the first protective layer and spaced apart from the first protective layer, wherein a first edge of the first protective layer faces a first edge of the second protective layer, wherein a space between the first edge of the first protective layer and the first edge of the second protective layer includes at least a first separation region and a second separation region, and wherein a first width of the space in the first separation region is different than a second width of the space in the second separation region.
Claims21
A circuit board comprising:
- a substrate;
- a first protective layer disposed on the substrate and including a first through hole;
- and
- a second protective layer disposed inside the first through hole and spaced apart from the first protective layer in a horizontal direction and including a plurality of second through holes,
- wherein the second protective layer includes a plurality of inner surfaces forming the plurality of second through holes, and an outer surface surrounding the plurality of inner surfaces,
- wherein an inner surface forming the first through hole of the first protective layer and the outer surface of the second protective layer each include one surface facing each other in the horizontal direction, and
- wherein a separation area between the one surface of the first protective layer and the one surface of the second protective layer includes a first separation area having a first width along the horizontal direction, and a second separation area having a second width different from the first width.
A circuit board comprising:
- a substrate;
- a first protective layer disposed on the substrate and including a first through hole;
- and
- a second protective layer disposed inside the first through hole and spaced apart from the first protective layer in a horizontal direction and including a plurality of second through holes,
- wherein the second protective layer includes a plurality of inner surfaces forming the plurality of second through holes, and an outer surface surrounding the plurality of inner surfaces,
- wherein a separation area between an inner surface forming the first through hole of the first protective layer and the outer surface of the second protective layer is provided as a closed loop along the outer surface of the second protective layer,
- wherein each of the inner surface of the first protective layer and the outer surface of the second protective layer are at least partially parallel to each other,
- wherein the substrate includes an uppermost insulating layer, and a plurality of pads and a plurality of traces disposed on an upper surface of the uppermost insulating layer,
- wherein the uppermost insulating layer includes a first region vertically overlapping with the first protective layer, a second region vertically overlapping with the second protective layer, and a third region between the inner surface of the first protective layer and the outer surface of the second protective layer, and
- wherein first electrodes of the plurality of pads and the plurality of traces are disposed in the third region.
Dependencies are inferred from the claim text.