Semiconductor device package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsMei-Yi Wu, Chang Chin Tsai, Bo-Yu Huang, Ying-Chung Chen
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Abstract
The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.
Claims9
A semiconductor device package, comprising:
- a substrate having a first surface and a second surface opposite to the first surface;
- an optical device disposed over the substrate;
- and
- an electronic device disposed under the substrate;
- a case disposed under the substrate and defining a space for accommodating the electronic device;
- and
- a thermal paste connecting the case and the electronic device;
- wherein a vertical projection of the optical device on the first surface overlaps with a vertical projection of the case on the second surface of the substrate.
Dependencies are inferred from the claim text.