Imaging element and semiconductor element
AssigneeSony Semiconductor Solutions Corporation
InventorsShinichi Miyake, Hirofumi Yamashita
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AssigneeSony Semiconductor Solutions Corporation
InventorsShinichi Miyake, Hirofumi Yamashita
Estimating the term…
An imaging element according to an embodiment of the present disclosure includes a first semiconductor substrate, and a second semiconductor substrate stacked over the first semiconductor substrate with an insulating layer interposed therebetween. The first semiconductor substrate includes a photoelectric conversion section, and a charge-holding section that holds charges transferred from the photoelectric conversion section. The second semiconductor substrate includes an amplification transistor that generates a signal of a voltage corresponding to a level of charges held in the charge-holding section. The amplification transistor includes a channel region, a source region, and a drain region in a plane intersecting a front surface of the second semiconductor substrate, and includes a gate electrode being opposed to the channel region with a gate insulating film interposed therebetween and being electrically coupled to the charge-holding section.
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Dependencies are inferred from the claim text.