Semiconductor package having ground bonding wire that crosses over signal bonding wire for crosstalk reduction and associated method
AssigneeAiroha Technology Corp.
InventorsChun-Wei Chen, Ming-Yin Ko, Yan-Bin Luo
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Abstract
A semiconductor package includes a printed circuit board (PCB), a semiconductor device, a first signal bonding wire, and a first ground bonding wire. The PCB includes a first PCB ground pad and a first PCB signal trace. The semiconductor device includes a first device ground pad and a first device signal pad. The first signal bonding wire is coupled between the first device signal pad and the first PCB signal trace. The first ground bonding wire is coupled between the first device ground pad and the first PCB ground pad, wherein the first ground bonding wire crosses over the first signal bonding wire.
Claims20
A semiconductor package comprising:
- a printed circuit board (PCB), comprising a first PCB ground pad and a first PCB signal trace;
- a semiconductor device, comprising a first device ground pad and a first device signal pad;
- a first signal bonding wire, coupled between the first device signal pad and the first PCB signal trace;
- and
- a first ground bonding wire, coupled between the first device ground pad and the first PCB ground pad, wherein the first ground bonding wire crosses over the first signal bonding wire.
A method for fabricating a semiconductor package, comprising:
- mounting a semiconductor device on a printed circuit board (PCB), wherein the PCB comprises a first PCB ground pad and a first PCB signal trace, and the semiconductor device comprises a first device ground pad and a first device signal pad;
- and
- performing a wire bonding process, comprising:
- coupling a first signal bonding wire between the first device signal pad and the first PCB signal trace;
- and
- coupling a first ground bonding wire between the first device ground pad and the first PCB ground pad, wherein the first ground bonding wire crosses over the first signal bonding wire.
Dependencies are inferred from the claim text.