Memory operation based on block-associated temperature
AssigneeMicron Technology, Inc.
InventorsPitamber Shukla, Ching-Huang Lu, Devin Batutis
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AssigneeMicron Technology, Inc.
InventorsPitamber Shukla, Ching-Huang Lu, Devin Batutis
Estimating the term…
Various embodiments provide for performing a memory operation, such as a memory block compaction operation or block folding or refresh operation, based on a temperature associated with a memory block of a memory device. For instance, some embodiments provide for techniques that can cause performance of a block compaction operation on a memory block at a temperature that is at least at or higher than a predetermined temperature value. Additionally, some embodiments provide for techniques that can cause performance of a block folding/refresh operation, at a temperature that is at or higher than the predetermined temperature value, on one or more blocks on which data was written at a temperature lower than the predetermined temperature value.
A system comprising:
At least one non-transitory machine-readable storage medium comprising instructions that, when executed by a processing device, cause the processing device to perform operations comprising:
A method comprising:
Dependencies are inferred from the claim text.