Semiconductor stitch structure and method for forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYou-Cheng Lu, Stefan Rusu, Lan-Chou Cho, Ming Yang Jung
Life of this patent
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Abstract
A semiconductor structure includes a plurality of semiconductor dies, a first stitch structure disposed in the plurality of semiconductor dies, and a second stitch structure disposed in at least two adjacent semiconductor dies of the plurality of semiconductor dies. The semiconductor dies are arranged to form a column or a row. The first stitch structure crosses all interfaces between the semiconductor dies. The second stitch structure crosses an interface between the at least two adjacent semiconductor dies.
Claims20
A semiconductor structure comprising:
- a plurality of semiconductor dies arranged to form a column or a row;
- a first stitch structure disposed in the semiconductor dies, wherein the first stitch structure crosses at least two interfaces between the semiconductor dies;
- and
- a second stitch structure disposed in at least two adjacent semiconductor dies of the plurality of semiconductor dies, wherein the second stitch structure crosses an interface between the two adjacent semiconductor dies,
- wherein the first stitch structure and the second stitch structure individually have a serpentine shape.
A semiconductor structure comprising:
- a plurality of semiconductor dies arranged to form a column or a row;
- a first stitch structure disposed in the semiconductor dies, wherein the first stitch structure crosses at least two interfaces between the semiconductor dies;
- and
- a second stitch structure disposed in at least two adjacent semiconductor dies of the plurality of semiconductor dies, wherein the second stitch structure crosses an interface between the two adjacent semiconductor dies,
- wherein the first stitch structure and the second stitch structure individually have a U shape.
A semiconductor structure comprising:
- a plurality of semiconductor dies arranged to form a column or a row;
- a first stitch structure disposed in the semiconductor dies, wherein the first stitch structure crosses at least two interfaces between the semiconductor dies;
- and
- a second stitch structure disposed in at least two adjacent semiconductor dies of the plurality of semiconductor dies, wherein the second stitch structure crosses an interface between the two adjacent semiconductor dies,
- wherein the first stitch structure comprises at least one first U-shaped segment disposed in a first semiconductor die of the plurality of semiconductor dies, and the second stitch structure comprises at least one second U-shaped segment disposed in a second semiconductor die of the plurality of semiconductor dies.
Dependencies are inferred from the claim text.