Semiconductor device including switch control circuit that controls switches based on test setting signal and method of manufacturing the same

A method of manufacturing a semiconductor device, the method comprising:

• a pre-process of forming a plurality of semiconductor devices on a semiconductor wafer;
• a wafer test process of testing the plurality of semiconductor devices using a probe inspection device;
• an assembly process of separating the plurality of semiconductor devices individually from the semiconductor wafer and packaging the individually separated plurality of semiconductor devices;
• and
• a final test process of testing the assembled plurality of semiconductor devices using a semiconductor inspection device,
• wherein the pre-process includes forming, in each of the plurality of semiconductor devices:
• a terminal circuit including a first external terminal and a second external terminal, wherein the first external terminal is configured to receive a test input signal from an external inspection device;
• a core unit that includes a first internal circuit provided corresponding to the first external terminal and a second internal circuit provided corresponding to the second external terminal, and performs signal processing, using at least one of the first internal circuit and the second internal circuit, on the test input signal received by at least one of the first internal circuit and the second internal circuit via the first external terminal to generate a test output signal, the test output signal being output to the external inspection device via the first external terminal;
• a switch circuit disposed on a wiring path between the terminal circuit and the core unit, wherein, when the external inspection device is connected to the first external terminal, the switch circuit selectively connects the first external terminal to the first internal circuit, the second internal circuit, or both the first internal circuit and the second internal circuit;
• and
• a switch control circuit that receives a test setting signal from the external inspection device and controls ON and OFF of one or more switches included in the switch circuit based on the test setting signal to select a connection destination of the external inspection device in the switch circuit,
• wherein the wafer test process includes outputting, by the probe inspection device, the test setting signal to the switch control circuit to output the test input signal to the first external terminal, or receiving the test output signal from the first external terminal.