Probe pin cleaning pad and cleaning method for probe pin

A probe pin cleaning pad, comprising:

• a first adhesive layer;
• a substrate layer, disposed on the first adhesive layer;
• a second adhesive layer;
• a foam layer, wherein the second adhesive layer is disposed between the substrate layer and the foam layer;
• a cleaning layer, wherein a material of the cleaning layer comprises:
• silicone resin, having a cross-linked network structure;
• and
• organic particles, having a Mohs hardness of less than 7;
• and
• a polishing layer, wherein the cleaning layer is disposed between the foam layer and the polishing layer, wherein a material of the polishing layer comprises:
• resin;
• and
• inorganic particles, having a Mohs hardness of large than or equal to 7,
• wherein:
• the foam layer has a closed-cell structure;
• the density of the foam layer is 0.1 g/cm3 to 0.6 g/cm3;
• the foam layer is disposed between the second adhesive layer and the cleaning layer;
• a portion of the cleaning layer is embedded in the foam layer;
• a portion of the second adhesive layer is embedded in the foam layer;
• and
• the probe pin cleaning pad is adapted for a probe pin with a plurality of substances attached thereto to penetrate through the polishing layer and to further penetrate into the cleaning layer for cleaning, and during the probe pin being sequentially extracted from the cleaning layer and the polishing layer, the plurality of substances is removed from the probe pin and are captured and/or trapped in the cross-linked network structure of the silicon resin of the cleaning layer.