Transduction detection device using piezoresistive element and a thermal dissipator element
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorsGuillaume Jourdan, Philippe Robert
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Abstract
A transduction detection device includes a substrate, at least one movable ground relative to the substrate and a suspended stress gauge provided with a piezoresistive element which includes a first anchoring and a second anchoring, different from the first anchoring, relative to the movable ground, wherein it includes at least one thermal dissipator element thermally conductively connected: to a connection portion of the piezoresistive element located outside of the anchorings, and to a thermal discharge part.
Claims21
A transduction detection device, comprising:
- a substrate;
- at least one movable ground relative to the substrate;
- a suspended stress gauge provided with a piezoresistive element which comprises a first anchoring relative to an anchoring portion and a second anchoring, different from the first anchoring, relative to the movable ground;
- and
- at least one thermal dissipator element thermally conductively connected at a first end to a first connection portion of the piezoresistive element located outside of the first and second anchorings, and at a second end at a second connection portion, to a thermal discharge part of the device, other than the piezoresistive element,
- wherein the thermal dissipator element includes an arm extending in a longitudinal direction and having, in a direction perpendicular to its longitudinal direction and to a detection direction, a dimension by height greater than a dimension by height of the piezoresistive element, and
- wherein the first end of the thermal dissipator element is directly connected to the piezoresistive element at the first connection portion and the second end of the thermal dissipator element is connected at the second connection portion at the thermal discharge part, and
- wherein the first connection portion and the second connection portion are located along a same longitudinal axis of the thermal dissipator arm.
Dependencies are inferred from the claim text.