Curable resin composition, a cured product, a laminated body composed of a cured product, and a method for disassembling thereof
AssigneeThreebond Co., Ltd.
InventorMasazumi Furukawa
Life of this patent
Estimating the term…
Abstract
The present invention relates to a curable resin composition capable of forming a cured product having excellent adhesive strength and easy dismantlability by an oxidizing agent, and capable of imparting excellent dismantlability when used as a primer to pretreat an adherend even when various adhesives, sealants, and coating agents are used. The curable resin composition includes the following components (A) and (B) but free of epoxy resin: Component (A): A compound having one or more (meth)acryloyl groups per molecule. Component (B): A hydrazide compound.
Claims16
A curable resin composition comprising the following components (A) to (C) but free of epoxy resin:
- Component (A):
- Polyethylene glycol diacrylate;
- Component (B):
- A hydrazide compound;
- and
- Component (C):
- An inorganic filler;
- wherein a melting point of the component (B) is 150 to 280° C., and wherein
- the content of the component (C) is 1 to 100 parts by mass with respect to 100 parts by mass of the component (A).
A method for preparing a curable resin composition comprising the following components (A) to (C) but free of epoxy resin:
- Component (A):
- Polyethylene glycol diacrylate;
- Component (B):
- A hydrazide compound;
- and
- Component (C):
- An inorganic filler;
- wherein a melting point of the component (B) is 150 to 280° C., and wherein
- the content of the component (C) is 1 to 100 parts by mass with respect to 100 parts by mass of the component (A).
Dependencies are inferred from the claim text.