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US 12,674,077 B2Granted
Polishing composition for semiconductor processing and method of polishing a substrate
AssigneeYcchem Co., Ltd.
InventorsSeung Chul Hong, Kangsik Myung, Deok Su Han, Han Teo Park, Yongsoo Choi
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Abstract
A composition for semiconductor processing includes polishing particles, water, and a biocide. The biocide includes a first biocide and a second biocide, the first biocide includes a thiazolinone-based compound, and the second biocide includes a chloric acid-based compound.
Claims15
A composition for semiconductor processing, the composition comprising:
- polishing particles, water, and a biocide,
- wherein the polishing particles comprise colloidal silica particles having a surface modified with an epoxy silane and an amino silane,
- wherein the biocide comprises a first biocide and a second biocide,
- wherein the first biocide comprises benzisothiazolinone (BIT), and
- wherein the second biocide comprises sodium hypochlorite.
2 more elements
Dependencies are inferred from the claim text.