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US 12,674,075 B2Granted
Polishing compositions and methods of use thereof
AssigneeFujifilm Electronic Materials U.S.A., Inc.
InventorsEric Turner, Bin Hu, Yannan Liang, James Johnston, James McDonough
Life of this patent
Estimating the term…
Abstract
A polishing composition includes an anionic abrasive; a pH adjuster; a transition metal catalyst; and an amino acid. A method of polishing a substrate includes the steps of: applying the polishing composition described herein to a surface of a substrate, wherein the surface comprises tungsten or molybdenum; and bringing a pad into contact with the surface of the substrate and moving the pad in relation to the substrate.
Claims18
A polishing composition, comprising:
- an anionic silica abrasive, wherein the anionic abrasive comprises terminal groups of formula (I):
- —Om—Si—(CH2)n—CH3 (I),
- in which m is an integer from 1 to 3;
- n is an integer from 0 to 10;
- the —(CH2)n—CH3 group is substituted by at least one carboxylic acid group;
- a pH adjuster;
- a transition metal catalyst;
- and
- an amino acid;
- wherein the polishing composition has a pH of about 1 to about 7, and
- wherein the polishing composition is free of anionic polymers and anionic surfactants.
8 more elements
Dependencies are inferred from the claim text.