Thermally conductive sheet
AssigneeSekisui Polymatech Co., Ltd.
InventorsHiromichi Iwazaki, Kentaro Kiuchi, Kenta Kuroo, Hiroki Kudoh
Life of this patent
Estimating the term…
Abstract
The present invention is a thermally conductive sheet comprising: a matrix comprising an organic polymer, and a carbon fiber X, the carbon fiber X being oriented in a thickness direction of the sheet, wherein a proportion of a carbon fiber (A) having a fiber length of 100 μm or less is 40% or more and a proportion of a carbon fiber (B) having a fiber length of 200 μm or more is 3 to 13% of the carbon fiber X. According to the present invention, a thermally conductive sheet in which the thermal resistance value is effectively reduced by polishing the surface, resulting in a sheet having a low thermal resistance value can be provided.
Claims7
A thermally conductive sheet comprising:
- a matrix comprising an organic polymer, and a carbon fiber X, the carbon fiber X being oriented in a thickness direction of the sheet,
- wherein a proportion of a carbon fiber (A) having a fiber length of 100 μm or less is 40% or more of the carbon fiber X and a proportion of a carbon fiber (B) having a fiber length of 200 μm or more is 3 to 13% of the carbon fiber X.
Dependencies are inferred from the claim text.