Hollow resin particles used in resin composition for semiconductor member
AssigneeSekisui Kasei Co., Ltd.
InventorsRyosuke Harada, Koichiro Okamoto
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Abstract
There is provided hollow resin particles used in a resin composition for semiconductor members, which can be used in a resin composition for semiconductor members to provide a semiconductor member capable of exerting excellent low dielectric properties. The hollow resin particles used in a resin composition for semiconductor members according to an embodiment of the present invention are hollow resin particles having a hole part inside the particle, wherein a decreasing rate of a relative dielectric constant Dk1 of a film (F1) formulated with 80 parts by weight of polyimide and 20 parts by weight of the hollow resin particles to a relative dielectric constant Dk0 of a film (F0) formed with only the polyimide is 3% or more.
Claims10
Hollow resin particles used in a resin composition for semiconductor members, having a hole part inside the particle,
- wherein a decreasing rate of a relative dielectric constant Dk1 of a film (F1) formulated with 80 parts by weight of polyimide and 20 parts by weight of the hollow resin particles to a relative dielectric constant Dk0 of a film (F0) formed with only the polyimide is 3% or more, and
- wherein a bulk specific gravity of the hollow resin particles is 0.01 g/cm3 to 0.6 g/cm3.
Dependencies are inferred from the claim text.