Hollow resin particles, method for producing hollow resin particles, and use of hollow resin particles
AssigneeSekisui Kasei Co., Ltd.
InventorsHaruhiko Matsuura, Shinya Matsuno
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Abstract
Provided is a hollow resin particle that has a shell portion and a hollow portion surrounded by the shell portion and that can achieve reductions in dielectricity and dielectric loss tangent and can exhibit excellent heat resistance. In addition, a method for producing such a hollow resin particle in a simple manner is provided. Furthermore, use of such a hollow resin particle is provided. A hollow resin particle according to an embodiment of the present invention is a hollow resin particle including a shell portion and a hollow portion surrounded by the shell portion, wherein the shell portion has an ether structure represented by formula (1).
Claims18
A hollow resin particle comprising a shell portion and a hollow portion surrounded by the shell portion,
- wherein the shell portion has an ether structure represented by formula (1),
- and
- wherein the hollow resin particle has an average particle diameter of 0.3 μm to 50.0 μm.
Dependencies are inferred from the claim text.