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US 12,673,470 B2Granted
Systems and methods for concurrent reaction-bonded joining and densification
AssigneeUchicago Argonne, LLC
InventorsDileep Singh, Wenchao Du
Life of this patent
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Abstract
A method can include providing two or more parts. The two or more parts can include a first part and a second part. The method can include disposing a source material between the first part and the second part. The method can include joining and densifying the first part and the second part by reacting a liquid with the source material.
Claims20
A method, comprising:
- providing two or more parts, the two or more parts comprising a first part and a second part;
- disposing a source material comprising a plurality of layers of carbon paper between the first part and the second part;
- and
- joining and densifying the first part and the second part by reacting a liquid comprising silicon with the source material to form a joint between the first part and the second part, the joint comprising alternating layers of silicon and silicon carbide.
1 more element
Dependencies are inferred from the claim text.