Electronic package having a chip with a trench in the surface

A method for manufacturing an electronic package, the method comprising:

• providing a full-panel wafer comprising a plurality of electronic bodies arranged in an array at intervals, wherein each of the electronic bodies has an active surface and an inactive surface opposing the active surface, the active surface has a plurality of electrode pads, and a plurality of trenches across each of the electronic bodies along a first direction are formed on the full-panel wafer, wherein the plurality of trenches on each of the electronic bodies are arranged parallel to each other at interval and along a second direction perpendicular to the first direction, wherein the active surface of the electronic element has at least one trench of the plurality of trenches;
• selecting one of the plurality of trenches to perform a singulation process to obtain a plurality of electronic elements;
• and
• disposing each of the electronic elements on a carrier structure, wherein a surface of the carrier structure is defined with a packaging region, the packaging region has a plurality of electrical contact pads therein, and each of the electronic elements is electrically connected to at least a portion of the plurality of electrical contact pads via the plurality of electrode pads thereof.