Thin film resistor, thermistor and method of producing the same

An apparatus comprising:

• a thin film resistor structure within a back end of line (BEOL) via level, the thin film resistor structure comprising:
• a lower resistor film;
• a first insulating layer over the lower resistor film;
• an upper resistor film over the first insulating layer;
• and
• a second insulating layer over the upper resistor film, and
• first and second upper metal lines above the second insulating layer,
• wherein a first end of the upper resistor film is coupled to the first upper metal line by a first upper contact, and a second end of the upper resistor film is coupled to the second upper metal line by a second upper contact,
• wherein a width of the lower resistor film is the same as a width of the first insulating layer, and a width of the upper resistor film is the same as a width of the second insulating layer.

A method comprising:

• forming a lower metal layer including first and second lower metal lines;
• forming a thin film resistor structure by:
• forming a lower resistor film over the lower metal layer;
• forming a first insulating layer over the first resistor film;
• forming an upper resistor film over the first insulating layer;
• and
• forming a second insulating layer over the second resistor film,
• forming first and second upper vias that extend through the upper resistor film to contact first and second ends of the upper resistor film, respectively;
• and
• forming first and second upper metal lines coupled to the first and second upper vias, respectively,
• wherein a width of the lower resistor film is the same as a width of the first insulating layer, and a width of the upper resistor film is the same as a width of the second insulating layer.