Manufacturing method for device embedded packaging structure

A method for manufacturing a device embedded packaging structure, the method comprising:

• laminating a first dielectric material on a top surface of a copper foil to form a first dielectric layer, and forming a first feature pattern in the first dielectric layer to expose the copper foil;
• etching an exposed copper foil to form a device opening frame and a via post opening frame so as to obtain a metal frame having the first dielectric layer;
• applying an adhesive layer on a bottom surface of the metal frame, and mounting a device on the adhesive layer in the device opening frame, wherein a terminal of the device is attached on the adhesive layer;
• laminating a second dielectric material to form a second dielectric layer, wherein the second dielectric layer covers the first dielectric layer and fills the device opening frame and the via post opening frame, and then removing the adhesive layer to expose the terminal of the device;
• and
• forming a via post in the via post opening frame, and forming a first wiring layer on an upper surface of the second dielectric layer and a second wiring layer on the bottom surface of the metal frame, wherein the terminal of the device is connected with the second wiring layer, and the first wiring layer and the second wiring layer are conductively connected by the via post.