Substrate processing apparatus and substrate processing method using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsHunjae Jang, Sangjine Park
Life of this patent
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Abstract
Provided is a substrate processing apparatus including a process chamber including a process space, a stage configured to support a substrate, a rotator configured to rotate the stage, a pressurizing pump configured to increase a pressure in the process space, and a cleaning agent discharger configured to spray a cleaning agent into the process space. The cleaning agent discharger includes a discharge ring including a discharge path through which the cleaning agent flows and a plurality of discharge nozzles connected to the discharge ring and spaced apart in a circumferential direction about a central axis of the stage.
Claims13
A substrate processing apparatus comprising:
- a process chamber including a process space;
- a stage configured to support a substrate;
- a rotator configured to rotate the stage;
- a pressurizing pump configured to increase a pressure in the process space;
- and
- a cleaning agent discharger configured to spray a cleaning agent into the process space,
- wherein the cleaning agent discharger includes:
- a discharge ring including a discharge path through which the cleaning agent flows;
- and
- a plurality of discharge nozzles connected to the discharge ring and spaced apart in a circumferential direction about a central axis of the stage,
- wherein each discharge nozzle of the plurality of discharge nozzles includes an elastic portion including an elastic hole that is configured to be opened and closed,
- wherein each discharge nozzle of the plurality of discharge nozzles further includes:
- a discharge body including a spray space and a central hole;
- a piezoelectric element configured to open and close the elastic hole of the corresponding elastic portion;
- and
- a filter between the elastic portion and the discharge ring, the filter being configured to block an inflow of foreign substances into the discharge nozzle, and
- wherein the elastic portion of each discharge nozzle of the plurality of discharge nozzles is configured to control a spraying cycle and a spraying amount of the cleaning agent.
A substrate processing apparatus comprising:
- a process chamber including a process space;
- a stage in the process space and configured to support a substrate;
- a rotator below the stage and configured to rotate the stage;
- a pressurizing pump configured to increase a pressure in the process space;
- and
- a cleaning agent discharger configured to spray a cleaning agent into the process space,
- wherein the cleaning agent discharger includes:
- a discharge ring including a discharge passage;
- and
- a discharge nozzle connected to the discharge ring, and
- wherein the discharge nozzle includes:
- a discharge body including a spray space connected to the discharge passage and a central hole through which the cleaning agent is sprayed into the process space;
- a piezoelectric element;
- and
- an elastic portion including an elastic hole that is opened and closed by the piezoelectric element, the elastic portion being configured to discharge the cleaning agent from the discharge passage into the process space to control a spraying cycle and a spraying amount of the cleaning agent.
Dependencies are inferred from the claim text.