Universal treatment solution, treatment method and use of perovskite layer

Abstract

A universal treatment solution, a treatment method and use of a perovskite layer are provided. The universal treatment solution includes a polar solvent and a non-polar solvent; the polar solvent includes amino and/or sulfonate. The treatment method includes: providing a perovskite layer; allowing the perovskite layer to be in contact with the universal treatment solution for a modified treatment; and removing the universal treatment solution. The universal treatment solution and treatment method can significantly improve the performance of a perovskite material. Since the principle of action does not change as the type and composition of the perovskite material change, the universal treatment solution and treatment method have a significant effect on the current perovskite material of almost all components. Meanwhile, the universal treatment solution has extremely strong reactivity, thus, the treatment method is extremely short in treatment time and has low requirements on treatment temperature and treatment devices.

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