Thermocompression device and method of manufacturing display device using same
AssigneeLG Electronics Inc.
InventorsEunjeong Kang, Byungjoon Rhee
Life of this patent
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Abstract
According to an embodiment, a thermocompression device for thermally compressing a semiconductor light emitting element array onto a wiring board may comprise: a lower head that supports the wiring board; an upper head that moves a donor including the semiconductor light emitting element array, and presses the semiconductor light emitting element array against a first region of the wiring board; a heating unit that heats at least one among the lower head and the upper head; a suction groove provided along an edge of the first region on the upper surface of the lower head; and a suctioning unit that communicates with the suction groove to suction the wiring board.
Claims20
A thermocompression device for thermally compressing a semiconductor light emitting element array to a wiring substrate, the thermocompression device comprising:
- a lower head for supporting the wiring substrate;
- an upper head for compressing the semiconductor light emitting element array to a first area of the wiring substrate using a donor having the semiconductor light emitting element array;
- a heater for heating at least one of the lower head and the upper head;
- a suction groove defined in an upper surface of the lower head along an edge of the first area;
- and
- a suction portion in communication with the suction groove and configured to hold the wiring substrate by suction.
A thermocompression device for thermally compressing a semiconductor light emitting element array to a wiring substrate, the thermocompression device comprising:
- a first head for supporting the wiring substrate;
- a second head for compressing the semiconductor light emitting element array to a first area of the wiring substrate using a donor having the semiconductor light emitting element array;
- a heater for heating at least one of the first head and the second head;
- a suction groove defined in an upper surface of the first head along an edge spaced apart from the first area;
- and
- a suction portion in communication with the suction groove configured to hold the wiring substrate on the upper surface of the first head by sucking air.
Dependencies are inferred from the claim text.