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US 12,672,238 B2Granted
Packaging architecture for a high frequency active electronically scanned array
AssigneeRockwell Collins, Inc.
InventorsRoss K. Wilcoxon, Jeremiah D. Wolf
Life of this patent
Estimating the term…
Abstract
A packaging architecture for a high frequency active electronically scanned array is described. The packaging architecture enables the thermal management benefits of a card-fed approach to be extended to higher-frequency AESA to operate with higher output power and/or duty cycle. The packaging architecture includes circuit cards that are non-rectangular in shape to provide room for thermal management solutions that are placed between adjacent circuit cards.
Claims16
A card-fed array comprising:
- a first plurality of circuit cards;
- a second plurality of circuit cards;
- wherein the first plurality of circuit cards alternate with the second plurality of circuit cards;
- wherein each of the first plurality of circuit cards and the second plurality of circuit cards comprise:
- a substrate;
- wherein the substrate comprises one or more wide portions and one or more narrow portions;
- wherein the one or more wide portions are wider than the one or more narrow portions;
- wherein the one or more narrow portions extend from the one or more wide portions;
- a plurality of radiating elements;
- wherein the plurality of radiating elements are disposed on the one or more wide portions of the substrate;
- wherein the plurality of radiating elements are arranged in a line;
- a plurality of transmission lines;
- a plurality of transmit/receive modules;
- wherein the plurality of transmit/receive modules are disposed on the one or more narrow portions of the substrate;
- wherein the plurality of transmission lines connect the plurality of radiating elements with the plurality of transmit/receive modules;
- and
- a plurality of backplane interfaces;
- wherein the plurality of backplane interfaces are coupled to the plurality of transmit/receive modules;
- a first plurality of thermal spreaders;
- wherein the first plurality of thermal spreaders are coupled to the one or more narrow portions of the substrates of the first plurality of circuit cards;
- and
- a second plurality of thermal spreaders;
- wherein the second plurality of thermal spreaders are coupled to the one or more narrow portions of the substrates of the second plurality of circuit cards;
- wherein the card-fed array is an active electronically scanned array;
- wherein the second plurality of circuit cards are mirrored to the first plurality of circuit cards;
- wherein the one or more narrow portions of the substrates of the second plurality of circuit cards are inverted to the one or more narrow portions of the substrates of the first plurality of circuit cards.
23 more elements
A card-fed array comprising:
- a first plurality of circuit cards;
- a second plurality of circuit cards;
- wherein the first plurality of circuit cards alternate with the second plurality of circuit cards;
- wherein each of the first plurality of circuit cards and the second plurality of circuit cards comprise:
- a substrate;
- wherein the substrate comprises one or more wide portions and one or more narrow portions;
- wherein the one or more wide portions are wider than the one or more narrow portions;
- wherein the one or more narrow portions extend from the one or more wide portions;
- a plurality of connectors;
- wherein the plurality of connectors are disposed on the wide portion of the substrate;
- wherein the plurality of connectors are arranged in a line;
- a plurality of transmission lines;
- a plurality of transmit/receive modules;
- wherein the plurality of transmit/receive modules are disposed on the one or more narrow portions of the substrate;
- wherein the plurality of transmission lines connect the plurality of connectors with the plurality of transmit/receive modules;
- and
- a plurality of backplane interfaces;
- wherein the plurality of backplane interfaces are coupled to the plurality of transmit/receive modules;
- a first plurality of thermal spreaders;
- wherein the first plurality of thermal spreaders are coupled to the one or more narrow portions of the substrates of the first plurality of circuit cards;
- a second plurality of thermal spreaders;
- wherein the second plurality of thermal spreaders are coupled to the one or more narrow portions of the substrates of the second plurality of circuit cards;
- and
- one or more third circuit cards;
- wherein the one or more third circuit cards are orthogonal to the first plurality of circuit cards and the second plurality of circuit cards;
- wherein the one or more third circuit cards comprise a plurality of radiating elements;
- wherein the plurality of radiating elements are connected to the plurality of connectors;
- wherein the card-fed array is an active electronically scanned array;
- wherein the second plurality of circuit cards are mirrored to the first plurality of circuit cards;
- wherein the one or more narrow portions of the substrates of the second plurality of circuit cards are inverted to the one or more narrow portions of the substrates of the first plurality of circuit cards.
27 more elements
Dependencies are inferred from the claim text.