Highly reliable multilayer ceramic through-hole capacitor and manufacturing method thereof

Abstract

Disclosed is a highly reliable multilayer ceramic through-hole capacitor. It includes a multilayer ceramic through-hole capacitor body, which has at least one inner hole for inserting a first controlled expansion alloy tube. A guide pin is inserted into the first controlled expansion alloy tube, which undergoes annealing and surface electroplating treatment. The guide pin, first controlled expansion alloy tube, and inner hole are all fixed using lead-free solder. By welding the first controlled expansion alloy tube with the inner hole of the disk-shaped multilayer ceramic capacitor, the stress resistance capability of the capacitor is improved. This eliminates the need for lead-containing soldering materials with high ductility in the production process, allowing the capacitor to withstand multiple temperature changes without ceramic cracking. As a result, the multilayer ceramic through-hole capacitor achieves high reliability even in harsh external environments.

Dependencies are inferred from the claim text.