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US 12,671,008 B2Granted
Electrically conductive one component (1K) epoxy formulation
AssigneeHenkel AG & Co. KGaA
InventorsMarc Estruga Ortiga, Anja Henckens
Life of this patent
Estimating the term…
Abstract
The present invention is directed to an electrically conductive composition comprising: a) a resin component comprising: 1) a first epoxy resin; and, 2) a second epoxy resin and/or a functionalised polybutadiene resin and/or a functionalised butadiene-acrylonitrile copolymer; b) a curative for epoxy resin; c) an electrically conductive filler; d) a one core shell rubber toughener; and, e) a reactive diluent component comprising 1) a monofunctional epoxy diluent and/or 2) a polyfunctional epoxy diluent; wherein said composition further comprises a curing agent if said functionalised polybutadiene resin is present in said resin component.
Claims15
An electrically conductive composition comprising:
- a) a resin component comprising
- 1) A first epoxy resin selected from the group consisting of aliphatic epoxy resin, cycloaliphatic epoxy resin, epoxy novolac resin, bisphenol-A-epoxy resin, bisphenol-F-epoxy resin, hydrogenated bisphenol-A-epoxy resin, hydrogenated bisphenol-F-epoxy resin, bisphenol-A epichlorohydrin based epoxy resin, polyepoxies, propylene glycol epoxy resin, reaction products of polyether-polyol with epichlorohydrin, epoxy silicone co-polymers and mixtures thereof, said first epoxy resin being present in amounts of from 4 to 17% by weight of the total composition;
- and
- 2) a second epoxy resin selected from the group consisting of epichlorohydrin formaldehyde phenol resin, epichlorohydrin phenol novolac resin, epichlorohydrin o-cresol novolac resin, epichlorohydrin m-xylenediamine resin, epichlorohydrin diamino diphenyl methane resin, epichlorohydrin trimethylol propane resin and mixtures thereof, said second epoxy resin being present in amounts of 0.3 to 3% by weight of the total weight of the composition;
- and/or a functionalised polybutadiene resin present in amounts of 0.1 to 15% by weight of the total weight of the composition, and/or a functionalised butadiene-acrylonitrile copolymer resin present in amounts of 0.1 to 5% by weight of the total weight of the composition and mixtures thereof any of the above;
- b) an electrically conductive filler;
- c) a curative for epoxy resin;
- d) a core shell rubber toughener present in amounts of 0.3 to 4.0% by weight of the total composition;
- and
- e) a reactive diluent component comprising
- 1) A monofunctional epoxy reactive diluent and/or
- 2) a polyfunctional epoxy reactive diluent;
- wherein said composition further comprises a curing agent if said functionalized polybutadiene resin is present in said resin component;
- wherein said composition is in the absence of a cyanate ester;
- and
- wherein the glass transition temperature (Tg) is 96-98° C. and the ΔCTETg is 16-29 ppm/° C. as measured by thermochemical analysis in accordance with ASTM E831 after thermal cycling between −40 C and 85 C for at least 200 cycles according to IEC 61315 10.11.
13 more elements
An electrically conductive composition comprising:
- a) a resin component consisting of
- 1) A first epoxy resin selected from the group consisting of aliphatic epoxy resin, cycloaliphatic epoxy resin, epoxy novolac resin, bisphenol-A-epoxy resin, bisphenol-F-epoxy resin, hydrogenated bisphenol-A-epoxy resin, hydrogenated bisphenol-F-epoxy resin, bisphenol-A epichlorohydrin based epoxy resin, polyepoxies, propylene glycol epoxy resin, reaction products of polyether-polyol with epichlorohydrin, epoxy silicone co-polymers and mixtures thereof, said first epoxy resin being present in amounts of from 4 to 17% by weight of the total composition;
- and
- 2) a second epoxy resin selected from the group consisting of epichlorohydrin formaldehyde phenol resin, epichlorohydrin phenol novolac resin, epichlorohydrin o-cresol novolac resin, epichlorohydrin m-xylenediamine resin, epichlorohydrin diamino diphenyl methane resin, epichlorohydrin trimethylol propane resin and mixtures thereof, said second epoxy resin being present in amounts of 0.3 to 3% by weight of the total weight of the composition;
- and/or a functionalised polybutadiene resin present in amounts of 0.1 to 15% by weight of the total weight of the composition, and/or a functionalised butadiene-acrylonitrile copolymer resin present in amounts of 0.1 to 5% by weight of the total weight of the composition and mixtures thereof any of the above;
- b) an electrically conductive filler;
- c) a curative for epoxy resin;
- d) a core shell rubber toughener present in amounts of 0.3 to 4.0% by weight of the total composition;
- and
- e) a reactive diluent component consisting of
- 1) A monofunctional epoxy reactive diluent and/or
- 2) a polyfunctional epoxy reactive diluent;
- wherein said composition may optionally include a curing agent if said functionalized polybutadiene resin is present in said resin component,
- wherein said composition may optionally include plasticizers;
- stabilizers;
- UV stabilizers;
- non-epoxy cyclic co-monomers;
- non-epoxy functional flexibilizers;
- tougheners other than core-shell rubber particles;
- adhesion promoters;
- conductivity promoters;
- anti-corrosion agents;
- anti-bleed agents;
- rheological adjuvants;
- particulate silica;
- modified silica;
- alumina;
- modified alumina;
- wetting agents;
- surfactants;
- antioxidants;
- radical scavengers;
- drying agents;
- fungicides;
- flame retardants;
- colour pigments;
- colour pastes;
- non-reactive solvents;
- or combinations thereof, and
- wherein the glass transition temperature (Tg) is 96-98° C. and the ΔCTETg is 16-29 ppm/° C. as measured by thermochemical analysis in accordance with ASTM E831 after thermal cycling between −40 C and 85 C for at least 200 cycles according to IEC 61315 10.11.
37 more elements
An electrically conductive composition comprising:
- a) a resin component comprising
- 1) A first epoxy resin selected from the group consisting of aliphatic epoxy resin, cycloaliphatic epoxy resin, epoxy novolac resin, bisphenol-A-epoxy resin, bisphenol-F-epoxy resin, hydrogenated bisphenol-A-epoxy resin, hydrogenated bisphenol-F-epoxy resin, bisphenol-A epichlorohydrin based epoxy resin, polyepoxies, propylene glycol epoxy resin, reaction products of polyether-polyol with epichlorohydrin, epoxy silicone co-polymers and mixtures thereof, said first epoxy resin being present in amounts of from 4 to 17% by weight of the total composition;
- and
- 2) a second epoxy resin selected from the group consisting of epichlorohydrin formaldehyde phenol resin, epichlorohydrin phenol novolac resin, epichlorohydrin o-cresol novolac resin, epichlorohydrin m-xylenediamine resin, epichlorohydrin diamino diphenyl methane resin, epichlorohydrin trimethylol propane resin and mixtures thereof, said second epoxy resin being present in amounts of 0.3 to 3% by weight of the total weight of the composition;
- and a functionalised polybutadiene resin present in amounts of 0.1 to 15% by weight of the total weight of the composition, and optionally a functionalised butadiene-acrylonitrile copolymer resin present in amounts of 0.1 to 5% by weight of the total weight of the composition and mixtures thereof any of the above;
- b) an electrically conductive filler;
- c) a curative for epoxy resin;
- d) a core shell rubber toughener present in amounts of 0.3 to 4.0% by weight of the total composition;
- and
- e) a reactive diluent component comprising
- 1) A monofunctional epoxy reactive diluent and/or
- 2) a polyfunctional epoxy reactive diluent;
- wherein said composition further comprises a curing agent;
- wherein said composition is in the absence of a cyanate ester;
- and wherein the glass transition temperature (Tg) is 96-98° C. and the ΔCTETg is 16-29 ppm/° C. as measured by thermochemical analysis in accordance with ASTM E831 after thermal cycling between −40 C and 85 C for at least 200 cycles according to IEC 61315 10.11.
12 more elements
Dependencies are inferred from the claim text.