Pixel, method of fabricating the pixel, and electronic device

A method of fabricating a pixel, comprising:

• forming a first bottom conductive layer including a plurality of first bottom conductive patterns;
• forming a second bottom conductive layer including a plurality of second bottom conductive patterns on the first bottom conductive layer;
• and
• forming a semiconductor layer on the second bottom conductive layer, wherein
• the first bottom conductive layer has a stacked structure including a first metal layer, an alloy layer, and a second metal layer stacked on each other,
• the second bottom conductive layer has a stacked structure including a first metal layer, an alloy layer, and a second metal layer stacked on each other, and
• a thickness of the alloy layer in the first bottom conductive layer is greater than a thickness of the alloy layer in the second bottom conductive layer.

An electronic device, comprising:

• a processor to provide input image data;
• and
• a display device to display an image based on the input image data, the display device including a pixel, wherein
• the pixel includes:
• a first bottom conductive layer including a plurality of first bottom conductive patterns;
• a second bottom conductive layer disposed on the first bottom conductive layer, and including a plurality of second bottom conductive patterns;
• and
• a semiconductor layer disposed on the second bottom conductive layer, wherein
• the first bottom conductive layer has a stacked structure including a first metal layer, an alloy layer, and a second metal layer stacked on each other,
• the second bottom conductive layer has a stacked structure including a first metal layer, an alloy layer, and a second metal layer stacked on each other, and
• a thickness of the alloy layer in the first bottom conductive layer is greater than a thickness of the alloy layer in the second bottom conductive layer.