3D volume inspection method and method of configuring of a 3D volume inspection method

A computer-implemented method, comprising:

• a) milling, with a dual beam system, a volume of a semiconductor object to provide an exposed surface of the semiconductor object;
• b) acquiring, with a dual beam system, according to a predetermined specification a two-dimensional image, of the exposed surface of the semiconductor object;
• c) evaluating, by a control unit of the dual beam device, the two-dimensional image, using a trained machine learning method to determine that whether the two-dimensional image conforms with a predetermined specification;
• d) based on c);
• when the two-dimensional image fails to conform with the predetermined specification, triggering an adjustment of the dual beam system and,
• when the two-dimensional image conforms with the predetermined specification, storing the two-dimensional image in a memory;
• e) iteratively repeating a) through d) to store a plurality of two-dimensional images that conform with the predetermined specification in the memory;
• and
• f) generating a three-dimensional volume image of the inspection volume using the plurality of two-dimensional images conforming with the predetermined specification,
• wherein the adjustment of the dual beam system comprises at least one of:
• adjusting the focused ion beam system to change a milling angle of the focused ion beam column relative to the semiconductor object, and
• adjusting the focused ion beam system to change a milling range of the focused ion beam column.