Photonic package and method for forming the same

A method of forming a semiconductor package, comprising:

• forming a first wafer, wherein the first wafer comprises a plurality of photonic dies, each photonic die comprising a first substrate, a grating coupler over a top surface of the first substrate, and first dielectric layers over the grating coupler;
• forming a second wafer, wherein the second wafer comprises a plurality of electronic dies, each electronic die comprising a second substrate, an electronic component on a top surface of the second substrate, and second dielectric layers over the electronic component;
• forming micro lenses directly on the top surface of the second substrate;
• forming openings in the second dielectric layers, wherein the openings are aligned with the micro lenses;
• filling the openings with optical material fillers;
• bonding the first wafer to the second wafer after forming the micro lenses and the optical material fillers;
• and
• performing a singulation process to dice the first wafer and the second wafer to form a plurality of photonic packages, wherein a photonic package of the plurality of photonic packages comprises an electronic die, a photonic die bonded to the electronic die, and a micro lens and corresponding optical material filler embedded in the electronic die, wherein the micro lens is aligned with the grating coupler.

A semiconductor package, comprising:

• a photonic die, comprising:
• a first redistribution structure;
• an optical layer over a first side of the first redistribution structure, wherein the optical layer comprises a grating coupler;
• and
• a first bond layer over a second side of the first redistribution structure opposite to the first side of the first redistribution structure;
• and
• an electronic die, comprising:
• an active component;
• a second redistribution structure over the active component;
• a second bond layer over the second redistribution structure and in direct contact with the first bond layer of the photonic die;
• a micro lens aside the active component and aligned with the grating coupler;
• and
• an optical material filler over the micro lens, extending through the second bond layer and the second redistribution structure, and aligned with the micro lens.