Inspection apparatus and inspection method
AssigneeTokyo Electron Limited
InventorShinjiro Watanabe
Life of this patent
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Abstract
An inspection apparatus for electrical inspection of a substrate is provided. The inspection apparatus includes: a probe card including a plurality of probes; a stage on which the substrate is placed, the stage being configured to move the substrate relative to the probe card and to bring the substrate into contact with the probes; and a controller configured to control a movement of the stage. The controller calculates, using a first displacement amount based on a vertical load of the probe card and a second displacement amount based on an unbalanced load of the probe card that is inclined with respect to the vertical load, a three-dimensional correction amount for the unbalanced load of the probe card, and the controller moves the stage based on the three-dimensional correction amount.
Claims17
An inspection apparatus for electrical inspection of a substrate, the inspection apparatus comprising:
- a probe card including a plurality of probes;
- a stage on which the substrate is placed, the stage being configured to move the substrate relative to the probe card and to bring the substrate into contact with the probes;
- a jig disposed above the stage, the jig being configured to apply a vertical load in a vertical direction to the substrate placed on the stage;
- and
- a controller configured to control a movement of the stage, wherein
- the controller calculates, using a first displacement amount based on a vertical component of a load of the probe card and a second displacement amount based on a horizontal component of the load of the probe card, a three-dimensional correction amount for the probe card,
- the controller moves the stage based on the three-dimensional correction amount,
- the first displacement amount varies according to a contact position of the probe card relative to the substrate placed on the stage when the vertical load applied by the jig is aligned with the vertical direction, and
- the second displacement amount is caused by an unbalanced load of the probe card regardless of the contact position of the probe card relative to the substrate placed on the stage.
An inspection method for electrical inspection of a substrate in an inspection apparatus, the inspection apparatus including:
- a probe card including a plurality of probes;
- a stage on which the substrate is placed, the stage being configured to move the substrate relative to the probe card and to bring the substrate into contact with the probes;
- and a jig disposed above the stage, the jig being configured to apply a vertical load in a vertical direction to the substrate placed on the stage, the inspection method comprising:
- calculating, using a first displacement amount based on a vertical component of a load of the probe card and a second displacement amount based on a horizontal component of the load of the probe card, a three-dimensional correction amount for the probe card;
- and
- moving the stage based on the three-dimensional correction amount, wherein
- the first displacement amount varies according to a contact position of the probe card relative to the substrate placed on the stage when the vertical load applied by the jig is aligned with the vertical direction, and
- the second displacement amount is caused by an unbalanced load of the probe card regardless of the contact position of the probe card relative to the substrate placed on the stage.
Dependencies are inferred from the claim text.