Semiconductor circuit arrangement and method for a semiconductor circuit arrangement

A semiconductor circuit arrangement, comprising:

• a substrate;
• a first stress-sensitive element in a first region of the substrate,
• a second stress-sensitive element in the first region of the substrate;
• a third stress-sensitive element in a second region of the substrate,
• wherein the second region is a reference region wherein a mechanical stress tensor in the second region is constant or negligible;
• a fourth stress-sensitive element in the second region of the substrate, wherein the first stress-sensitive element has an electrical characteristic which is dependent at least on a first component of a mechanical stress tensor in the first region,
• wherein the third stress-sensitive element has an electrical characteristic which is dependent at least on a first component of a mechanical stress tensor in in the second region,
• wherein the second stress-sensitive element has an electrical characteristic which is dependent on at least a second component of the mechanical stress tensor in the first region, and
• wherein the fourth stress-sensitive element has an electrical characteristic which is dependent at least on a second component of the mechanical stress tensor in the second region;
• and
• a measuring circuit configured:
• based on the electrical characteristic of the first stress-sensitive element and the electrical characteristic of the third stress-sensitive element, to determine a first stress difference between the first component of the mechanical stress tensor in the first region and the first component of the mechanical stress tensor in the second region);
• and
• based on the electrical characteristic of the second stress-sensitive element and the electrical characteristic of the fourth stress-sensitive element, to determine a second stress difference between the second component of the mechanical stress tensor in the first region and the second component of the mechanical stress tensor in the second region.

A method for a semiconductor circuit arrangement comprising:

• wherein the semiconductor circuit arrangement comprises a substrate comprising:
• at least two first stress-sensitive elements in a first region of the substrate, wherein the at least two first stress-sensitive elements each have an electrical characteristic which is dependent on a first component of a mechanical stress tensor in the first region and a second component of the mechanical stress tensor in the first region;
• and
• at least two second stress-sensitive elements in a second region of the substrate, wherein the at least two second stress-sensitive elements each have an electrical characteristic which is dependent on a first component of a mechanical stress tensor in the second region and a second component of the mechanical stress tensor in the second region, and
• wherein the second region is a reference region wherein the mechanical stress tensor in the second region is constant or negligible;
• and
• wherein the method comprises:
• determining, based on the electrical characteristic of each of the at least two first stress-sensitive elements and the electrical characteristic of each of the at least two second stress-sensitive elements, a first stress difference between the first component of the mechanical stress tensor in the first region and the first component of the mechanical stress tensor in the second region;
• and
• determining, based on the electrical characteristic of each of the at least two first stress-sensitive elements and the electrical characteristic of each of the at least two second stress-sensitive elements, a second stress difference between the second component of the mechanical stress tensor in the first region and the second component of the mechanical stress tensor in the second region.