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US 12,669,353 B2Granted
Systems and methods to increase sensor robustness
AssigneeMound Laser & Photonics Center, Inc.
InventorsClark T. Olsen, Michael W. Davis, Douglas P. Riemer, Matthew S. Lang
Life of this patent
Estimating the term…
Abstract
An apparatus is described. The apparatus including a substrate; one or more sensors and one or more electrical circuits formed on the substrate, the one or more electrical circuits electrically coupled with at least one of the one or more sensors; and a metal layer formed over the sensors, wherein the metal layer is positioned over the one or more sensors to provide a barrier.
Claims25
An apparatus comprising:
- a substrate;
- a first dielectric layer formed on a first side of the substrate, wherein the first dielectric layer is patterned to expose part of the substrate between portions of first dielectric layer;
- a first metal layer disposed on at least one of the portions of the first dielectric layer, wherein the first metal layer is patterned to form one or more sensors in the first metal layer;
- a second dielectric layer with patterned portions of the second dielectric layer formed over at least the one or more sensors of the first metal layer and the portions of the first dielectric layer;
- a second metal layer disposed over the second dielectric layer, the second metal layer including one or more electrical circuits and a via to electrically couple the one or more electrical circuits to the at least one of the one or more sensors formed in the first metal layer through the second dielectric layer;
- the second metal layer is positioned over the first metal layer and configured to provide a physical barrier covering the one or more sensors;
- a third dielectric layer disposed on the second metal layer, wherein the third dielectric layer is patterned to form one or more openings that expose any of the one or more electrical circuits and the via;
- a first gold plated pad disposed over any of the one or more openings in electrical communication with the one or more electrical circuits exposed via the one or more openings and configured to form a first electrical contact for the one or more electrical circuits;
- and
- a second gold pad disposed on a second side of the substrate opposite to the first side, the second gold pad in electrical communication with the one or more electrical circuits and the second gold pad forming a second electrical contact for the one or more electrical circuits.
7 more elements
A sensor comprising:
- a substrate;
- a first dielectric layer disposed on a first side of the substrate, wherein the first dielectric layer is patterned to expose part of the substrate between portions of first dielectric layer;
- a first metal layer disposed on at least one of the portions of the first dielectric layer, the first metal layer including one or more sensor components formed in the first metal layer;
- a second dielectric layer with patterned portions of the second dielectric layer formed over at least the one or more sensors of the first metal layer and the portions of the first dielectric layer;
- a second metal layer disposed over the second dielectric layer, the second metal layer including one or more electrical circuits and a via to electrically couple the one or more electrical circuits to the at least one of the one or more sensors formed in the first metal layer through the second dielectric layer;
- a third dielectric layer disposed on the second metal layer, wherein the third dielectric layer is patterned to form one or more openings that expose any of the one or more electrical circuits and the via;
- a first gold plated pad disposed over any of the one or more openings in electrical communication with the one or more electrical circuits exposed via the one or more openings and configured to form a first electrical contact for the one or more electrical circuits;
- and
- a second gold pad disposed on a second side of the substrate opposite to the first side, the second gold pad in electrical communication with the one or more electrical circuits and the second gold pad forming a second electrical contact for the one or more electrical circuits;
- and
- a border feature disposed around the one or more sensor components.
8 more elements
A method for increasing sensor robustness comprising;
- disposing a first dielectric layer over a first side of a substrate, wherein the first dielectric layer is patterned to expose part of the substrate between portions of first dielectric layer;
- forming a first metal layer on at least one of the portions of the first dielectric layer;
- forming one or more sensors in the first metal layer;
- forming a second dielectric layer with patterned portions of the second dielectric layer over at least the one or more sensors of the first metal layer and the portions of the first dielectric layer;
- forming a second metal layer over the second dielectric layer, the second metal layer positioned over the one or more sensors to form a barrier that prevents moisture or oxygen from penetrating onto the one or more sensors, the second metal layer including one or more electrical circuits and a via to electrically couple the one or more electrical circuits to the at least one of the one or more sensors formed in the first metal layer through the second dielectric layer;
- forming a third dielectric layer on the second metal layer, wherein the third dielectric layer is patterned to form one or more openings that expose any of the one or more electrical circuits and the via;
- disposing a first gold plated pad over any of the one or more openings in electrical communication with the one or more electrical circuits exposed via the one or more openings and configured to form a first electrical contact for the one or more electrical circuits;
- and
- disposing a second gold pad on a second side of the substrate opposite to the first side, the second gold pad in electrical communication with the one or more electrical circuits and the second gold pad forming a second electrical contact for the one or more electrical circuits.
6 more elements
An apparatus comprising:
- a substrate;
- a first dielectric layer formed on a first side of the substrate, wherein the first dielectric layer is patterned to expose part of the substrate between portions of first dielectric layer;
- a first metal layer disposed on at least one of the portions of the first dielectric layer, the first metal layer including one or more electrical circuits;
- a second dielectric layer with patterned portions of the second dielectric layer formed over at least the one or more electrical circuits of the first metal layer and the portions of the first dielectric layer;
- a second metal layer disposed over the second dielectric layer, the second metal layer including one or more sensors;
- a third dielectric layer disposed on the second metal layer, wherein the third dielectric layer is patterned to form one or more openings that expose any of the one or more electrical circuits and the via;
- a third metal layer is disposed over the second metal layer and configured to provide a physical barrier covering the one or more sensors;
- a first gold plated pad disposed over any of the one or more openings in electrical communication with the one or more electrical circuits exposed via the one or more openings and configured to form a first electrical contact for the one or more electrical circuits;
- and
- a second gold pad disposed on a second side of the substrate opposite to the first side, the second gold pad in electrical communication with the one or more electrical circuits and the second gold pad forming a second electrical contact for the one or more electrical circuits.
7 more elements
Dependencies are inferred from the claim text.