Substrate processing apparatus
AssigneeKokusai Electric Corporation
InventorsSatoshi Takano, Shun Matsui
Life of this patent
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Abstract
Described herein is a technique capable of forming a film so as to fill a recess of a substrate. According to one aspect thereof, there is provided a substrate processing apparatus including: a substrate mounting table on which a substrate is placed; an adsorption inhibiting gas supplier configured to supply an adsorption inhibiting gas onto a surface of the substrate from above the substrate mounting table; and a source gas supplier configured to supply a source gas onto the surface of the substrate from above the substrate mounting table, wherein a distance D1 between a gas supply port provided in the adsorption inhibiting gas supplier and the substrate is greater than a distance D2 between a gas supply port provided in the source gas supplier and the substrate.
Claims18
A substrate processing apparatus comprising:
- a substrate mounting table on which a substrate with a recess formed on the surface thereof is placed;
- an adsorption inhibiting gas supplier configured to supply an adsorption inhibiting gas onto the surface of the substrate from above the substrate mounting table;
- a source gas supplier configured to supply a source gas onto the surface of the substrate from above the substrate mounting table;
- an elevator configured to elevate or lower the adsorption inhibiting gas supplier without elevating or lowering the source gas supplier to change a distance D1 between a gas supply port provided in the adsorption inhibiting gas supplier and the substrate, in a state where the distance D1 is greater than a distance D2 between a gas supply port provided in the source gas supplier and the substrate;
- and
- a controller configured to control the adsorption inhibiting gas supplier and the source gas supplier to:
- perform a cycle a predetermined number of times wherein the cycle comprises (a) supplying the adsorption inhibiting gas to the substrate and (b) supplying the source gas to the substrate;
- and stop a supply of the adsorption inhibiting gas but continue a supply of the source gas when the recess is filled to meet a predetermined condition.
A substrate processing method, comprising:
- (a) placing a substrate with a recess formed on the surface thereof on a substrate mounting table;
- (b) supplying an adsorption inhibiting gas onto the surface of the substrate from above the substrate mounting table;
- (c) supplying a source gas onto the surface of the substrate from above the substrate mounting table;
- (d) changing a distance D1 between a gas supply port provided in an adsorption inhibiting gas supplier and the substrate in a state where the distance D1 is greater than a distance D2 between a gas supply port provided in a source gas supplier and the substrate, by elevating or lowering the adsorption inhibiting gas supplier while the source gas supplier is not being elevated or lowered;
- and
- (e) performing a cycle a predetermined number of times wherein the cycle comprises supplying the adsorption inhibiting gas to the substrate and supplying the source gas to the substrate, and stopping a supply of the adsorption inhibiting gas but continuing a supply of the source gas when the recess is filled to meet a predetermined condition.
A non-transitory computer-readable recording medium storing a program that causes, by a computer, a substrate processing apparatus to perform:
- (a) placing a substrate with a recess formed on the surface thereof on a substrate mounting table;
- (b) supplying an adsorption inhibiting gas onto the surface of the substrate from above the substrate mounting table;
- (c) supplying a source gas onto the surface of the substrate from above the substrate mounting table;
- (d) changing a distance D1 between a gas supply port provided in an adsorption inhibiting gas supplier and the substrate in a state where the distance D1 is greater than a distance D2 between a gas supply port provided in a source gas supplier and the substrate, by elevating or lowering the adsorption inhibiting gas supplier while the source gas supplier is not elevated or lowered;
- and
- (e) performing a cycle a predetermined number of times wherein the cycle comprises supplying the adsorption inhibiting gas to the substrate and supplying the source gas to the substrate, and stopping a supply of the adsorption inhibiting gas but continuing a supply of the source gas when the recess is filled to meet a predetermined condition.
Dependencies are inferred from the claim text.