Ion beam deposition of ruthenium thin films
AssigneeVeeco Instruments Inc.
InventorsRutvik J. Mehta, Yuejing Wang, Robert Caldwell, Frank Cerio
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AssigneeVeeco Instruments Inc.
InventorsRutvik J. Mehta, Yuejing Wang, Robert Caldwell, Frank Cerio
Estimating the term…
Methods for forming a low resistivity ruthenium (Ru) thin film that include depositing ruthenium onto a substrate via ion beam deposition with assist ion beam in a process chamber having reactive and noble gas species therein. The substrate is at at least 250° C. A resulting thin ruthenium film has a thickness of no more than 30 nm, a resistivity less than 12 μ·cm and a crystalline structure comprising grains having a (0001) orientation. The resistivity will differ at different thickness; for example, less than 9 μΩ-cm for films of 50 nm and thicker, less than 9.5 μΩ-cm for films of 35 nm and thicker, less than 11 μΩ-cm for films of 20 nm and thicker, less than 15 μΩ-cm for films of 10 nm and thicker or less than 20 μΩ-cm for films of 2 nm and thicker. The grains have a mean grain size at least three times the film thickness.
A method of forming a ruthenium film having a thickness at least 10 nm, a resistivity less than 15 μΩ-cm, and a polycrystalline structure comprising grains having a (0001) orientation, the method comprising:
A method of forming a ruthenium film having a thickness at least 10 nm, a resistivity less than 15 μΩ-cm, and a polycrystalline structure comprising grains having a (0001) orientation, the method comprising:
A ruthenium film comprising:
Dependencies are inferred from the claim text.