Thermally conductive curable composition

A moisture-curable composition, consisting of two individual components A and B that are stored in separated containers and mixed before or during applications to yield the moisture-curable composition,

• wherein the component A comprises, based on component A:
• between 1.2 and 9.0 wt.-% of at least one organic polymer P containing reactive silane groups, wherein the organic polymer P containing reactive silane groups is a polyurethane containing reactive silane groups or a polyether containing reactive silane groups or a mixed form of these polymers;
• between 0.3 and 2.0 wt.-% of at least one organosilane or oligomers thereof;
• between 80 and 93 wt.-% of at least one filler F;
• between 1 and 3 wt.-% at least one dispersion additive D;
• between 4 and 10 wt.-% of at least one plasticizer PL;
• the component B comprises, based on component B,
• between 3 and 10 wt.-% of the plasticizer PL;
• between 85 and 95 wt.-% of the at least one filler F;
• between 1 and 3 wt.-% of the dispersion agent D;
• between 0.5 and 2.5 wt.-% of water;
• between 0 and 1.5 wt.-% of a catalyst for the curing of silane-functional polymers;
• wherein
• the filler F is selected from the group consisting of aluminium oxide, aluminium hydroxide, boron nitride, aluminium nitride, zinc oxide, and any mixture of these fillers;
• with the proviso that the amount of chalk in the filler F does not exceed 25 wt.-% of the total amount of filler F;
• and
• wherein
• the composition does not contain polydiorganosiloxanes.