Package for silicon photonics device and implementation method thereof

A package for a silicon photonics device, the package comprising:

• a step difference control part having an upper surface, on which a silicon photonics device platform having a silicon photonics device mounted thereon is mounted, and configured to control a step difference generated between the silicon photonics device platform and one or more functional electronic devices;
• a functional device mounting part on which the one or more functional electronic devices are mounted and which is formed in a shape surrounding the step difference control part;
• and
• a body part configured to transfer heat transferred through the step difference control part and heat transferred through a lower surface of the functional device mounting part to the outside by mounting the step difference control part on at least a partial region of an upper surface of the body part and bringing the lower surface of the functional device mounting part into close contact with at least a portion of a remaining region of the upper surface of the body part other than the partial region of the upper surface of the body part.