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US 12,666,993 B1Granted
Removable covers for air cavity surface mount packages
AssigneeCAES Systems LLC
InventorJeffrey Sloane
Life of this patent
Estimating the term…
Abstract
An air cavity surface mount package including a package base, one or more package interconnects disposed at least partially on the package base and a device cover that is temporarily adhered to the package base by an intentionally weak adhesive. The adhesive includes a threshold amount of low strength adhesive material to allow for the non-damaging removal of the device cover from the air cavity surface mount package.
Claims16
An air cavity surface mount package, comprising:
- a package base;
- one or more package interconnects disposed at least partially on a carrier substrate of the package base;
- and
- a device cover temporarily adhered to the package base, wherein the device cover is temporarily adhered to the package base by an adhesive comprising a threshold amount of a low strength adhesive material, wherein the adhesive has an adhesive strength that is at least five times a weight of the air cavity surface mount package and less than a threshold force corresponding to a material strength or an attachment strength of the one or more package interconnects.
1 more element
A method comprising:
- selecting an adhesive for temporarily adhering a device cover to a package base of an air cavity surface mount package;
- applying the adhesive to temporarily adhere the device cover to the package base of the air cavity surface mount package;
- providing the air cavity surface mount package for at least one of refinishing or circuit board assembly;
- and
- removing the device cover from the package base.
2 more elements
Dependencies are inferred from the claim text.