SiC semiconductor substrate and fabrication method of the SiC semiconductor substrate
AssigneeRohm Co., Ltd.
InventorsNoriyuki Masago, Takuji Maekawa, Mitsuru Morimoto, Takayasu Oka
Life of this patent
Estimating the term…
Loading patent…
AssigneeRohm Co., Ltd.
InventorsNoriyuki Masago, Takuji Maekawa, Mitsuru Morimoto, Takayasu Oka
Estimating the term…
A semiconductor substrate (1) includes: an SiC single crystal substrate (10SB), a first graphene layer (11GR1) disposed on an Si plane of the SiC single crystal substrate 10SB; an SiC epitaxial growth layer (12RE) formed above the SiC single crystal substrate via the first graphene layer; and a second graphene layer (11GR2) disposed on an Si plane of the SiC epitaxial growth layer. There is also included an SiC polycrystalline substrate (16P) provisionally bonded onto the SiC epitaxial growth layer via the second graphene layer. The SiC single crystal substrate is able to be reused by being separated from the SiC epitaxial growth layer. This semiconductor substrate further includes an SiC polycrystalline growth layer (18PC) CVD grown on the C plane of the SiC epitaxial growth layer; and the SiC epitaxial growth layer is transferred to the SiC polycrystalline growth layer.
An SiC semiconductor substrate, comprising:
A fabrication method of an SiC semiconductor substrate, comprising:
Dependencies are inferred from the claim text.