Back to results
US 12,666,579 B2Granted
Electronic device cooling heat from electronic elements
AssigneeHyundai Mobis Co., Ltd.
InventorsSung Hyun Park, Hyun Seong Lee, Sang Eon Im, Sun Jong Oh, Byung Soo Kim
Life of this patent
Estimating the term…
Abstract
The electronic device includes a housing, a substrate disposed in an interior of the housing, an electronic element mounted on the substrate, a first cooling member in contact with the electronic element and configured to absorb heat generated by the electronic element, and a second cooling member spaced apart from the electronic element and configured to circulate air into and out of the housing.
Claims16
An electronic device comprising:
- a housing;
- a substrate disposed in an interior of the housing;
- an electronic element mounted on the substrate;
- a first cooling member in contact with the electronic element and configured to absorb heat generated by the electronic element;
- and
- a second cooling member spaced apart from the electronic element and configured to circulate air into and out of the housing,
- wherein the first cooling member includes:
- a heat pipe including a first end in contact with the electronic element and a second end spaced apart from the first end, and configured to transfer the heat received from the electronic element from the first end toward the second end;
- and
- a heat dissipation member in contact with the heat pipe and configured to dissipate heat received from the heat pipe to the outside of the housing,
- wherein the second cooling member includes:
- a fan coupled to the housing and configured to draw the air from the outside to the inside of the housing;
- a first guide portion guiding, toward the heat pipe, a flow of a portion of the air drawn to the inside of the housing by the fan;
- and
- a second guide portion guiding, toward the heat dissipation member, a flow of another portion of the air drawn to the inside of the housing by the fan,
- wherein the heat dissipation member includes:
- a heat dissipation body coupled to the housing and in contact with the heat pipe;
- a first heat dissipation portion protruding from the heat dissipation body toward the outside of the housing;
- and
- a second heat dissipation portion protruding from the heat dissipation body toward the outside of the housing and spaced apart from the first heat dissipation portion,
- wherein the second guide portion includes an outer channel externally disposed on the housing in a position facing the first heat dissipation portion, and
- wherein a first blocking member is disposed between the first heat dissipation portion and the second heat dissipation portion and configured to block moisture from entering the outer channel.
19 more elements
An electronic device comprising:
- a housing;
- a substrate disposed in an interior of the housing;
- an electronic element mounted on the substrate;
- a first cooling member in contact with the electronic element and configured to absorb heat generated by the electronic element;
- and
- a second cooling member spaced apart from the electronic element and configured to circulate air into and out of the housing,
- wherein the first cooling member includes:
- a heat pipe including a first end in contact with the electronic element and a second end spaced apart from the first end, and configured to transfer the heat received from the electronic element from the first end toward the second end;
- and
- a heat dissipation member in contact with the heat pipe and configured to dissipate heat received from the heat pipe to the outside of the housing,
- wherein the second cooling member includes:
- a fan coupled to the housing and configured to draw the air from the outside to the inside of the housing;
- a first guide portion guiding, toward the heat pipe, a flow of a portion of the air drawn to the inside of the housing by the fan;
- and
- a second guide portion guiding, toward the heat dissipation member, a flow of another portion of the air drawn to the inside of the housing by the fan;
- wherein the heat dissipation member includes:
- a heat dissipation body coupled to the housing and in contact with the heat pipe;
- a first heat dissipation portion protruding from the heat dissipation body toward the outside of the housing;
- and
- a second heat dissipation portion protruding from the heat dissipation body toward the outside of the housing and spaced apart from the first heat dissipation portion,
- wherein the second guide portion includes:
- an outer channel externally disposed on the housing in a position facing the first heat dissipation portion;
- and
- a transfer hole penetrating through the heat dissipation body so as to be connected to the outer channel and configured to transfer the air drawn to the inside of the housing to the outer channel,
- wherein a blocking member is protruded from the outer channel toward the transfer hole and configured to block moisture from entering the inside of the housing.
22 more elements
Dependencies are inferred from the claim text.