Flexible and stretchable structures
AssigneeLiquid Wire Inc.
InventorsTrevor Antonio Rivera, Michael Adventure Hopkins, Mark William Ronay
Life of this patent
Estimating the term…
Abstract
Devices, systems, and methods include a substrate layer, a metal layer coupled to the substrate layer, an encapsulant coupled to the substrate layer and the metal layer, and a stencil-in-place structure. The encapsulant is configured to electrically isolate the metal layer from environmental conditions. The stencil-in-place structure includes a stencil substrate and conductive gel secured within a channel and a via formed by the stencil substrate, the conductive gel electrically coupled to the metal layer.
Claims23
An apparatus, comprising:
- a substrate layer;
- a metal layer coupled to the substrate layer, wherein the metal layer comprises a metal foil;
- an encapsulant coupled to the substrate layer and the metal layer, the encapsulant configured to electrically isolate the metal layer from environmental conditions;
- and
- at least one via extending through the substrate layer coupling the metal foil to a pattern of traces formed on a surface of the substrate opposite the metal foil, wherein the via and the pattern of traces comprise a fluid phase conductor.
An apparatus comprising:
- a substrate layer;
- a metal layer coupled to the substrate layer;
- an encapsulant coupled to the substrate layer and the metal layer, the encapsulant configured to electrically isolate the metal layer from environmental conditions;
- and
- a stencil-in-place structure, comprising a stencil substrate layer and conductive gel secured within a channel and a via formed by the stencil substrate layer, the conductive gel electrically coupled to the metal layer.
An apparatus, comprising:
- a substrate layer;
- a metal layer coupled to the substrate layer;
- and
- an encapsulant coupled to the substrate layer and the metal layer, the encapsulant configured to electrically isolate the metal layer from environmental conditions;
- an electronic component coupled to at least one of the metal layer and the encapsulant;
- a stencil-in-place structure, comprising a stencil substrate layer and conductive gel secured within a channel and a via formed by the stencil substrate layer, the conductive gel electrically coupled to the metal layer.
Dependencies are inferred from the claim text.