Apparatus and method for treating substrate

A method for treating a substrate, the method comprising:

• a first treatment step of hydrophobicizing a surface of a first substrate such that the surface of the first substrate has a first hydrophobic property, by supplying a hydrophobic gas to the first substrate at a flow rate and through a supply tube inserted into a central hole included in a flow forming plate, the flow forming plate being in a chamber and dividing a process space of the chamber into an upper space and a lower space, a bottom of the flow forming plate and a lower end of the supply tube being at a same height;
• a second treatment step of hydrophobicizing a surface of a second substrate such that the surface of the second substrate has a second hydrophobic property, by supplying the hydrophobic gas to the second substrate at the flow rate through the supply tube, and
• an exhaust step of releasing process by-products through a plurality of exhaust holes included in an edge region of the flow forming plate, wherein
• the first hydrophobic property and the second hydrophobic property is configured to have different degrees of hydrophobization by controlling a first distance between a dispensing end through which the hydrophobic gas is dispensed and the first substrate in the first treatment step to be different from a second distance between the dispensing end through which the hydrophobic gas is dispensed and the second substrate in the second treatment step,
• the first substrate is a substrate different from the second substrate, and
• the controlling the first distance to be different from the second distance includes causing the first substrate and the second substrate to be raised or lowered on a support plate within a substrate treating apparatus.